Layer
Construction:
Single-Sided
Flex Rigid
Multilayer
Double-Sided
Dual Access
Unsupported Leads
Trace/Space:
1/2 oz. copper - .003”/.003”
+/- .0005”
1 oz. copper - .006”/.006” +/-
.0015”
2 oz. copper - .012”/.012” +/-
.003”
Etch capabilities up to 14 oz.
Radii:
Outside minimum sharp 90°
Inside standard .030”
Inside absolute minimum .010”
Plating:
Electroless Copper
Electrolytic Copper
Hard & Soft Gold
Tin Immersion
Electrolytic Tin Lead (Solder)
Hot Air Level
Entek Organic Coating
Material:
Polyimide
Kapton
Teflon/Duroid
FR4
Getek
Thermount
Epoxy & Acrylic Adhesive
Systems (UL approved)
Adhesiveless Copper-Clad
Laminates (IPC)
Meet CTE & Thermal Requirements by Incorporating:
CIC Cores
(Copper-Invar-Copper)
CMC Cores (Copper-Moly-Copper)
Copper or Aluminum Cores
Bonded Heatsinks
Soldermask:
Dry Film Mask (3 or 4 mils)
Conformask
LPI (Liquid Photo Imageable)
Various Colors
Kapton/Standard Thickness for Base, Cover film & Stiffeners:
.5 mil
1.0 mil
2.0 mil
3.0 mil
4.0 mil
5.0 mil
6.0 mil
Electrical
Testing:
Net List Test
Flying Probe Test
Through Hole Test
Dual Access Test
Product Built to ANSI/IPC & Military Standards
Additional Capabilities:
FR4 & Kapton stiffeners
Design & documentation
Microwave applications
Folding & PSA lamination of
3-dimensional stiffeners
Custom machining such as
headers & brackets
Creasing
Hardware installation
Impedance cables/assemblies
