Standard PCB Thickness:
.014” D/S – 4 layers
.018” D/S – 6 layers
.062” D/S – 12 layers
.093” D/S – 20 layers
.125” D/S – 30 layers
.250” - Maximum
Max. Panel Size:
24” x 36”
Line & Space:
0.004”/0.004” IL
0.004”/0.004” OL
Min. Hole Size (finished):
Single & D/S = .008”
Buried/Blind Via
Multilayer = .004” Microvia
Via Hole Drill
Diameter:
0.008” (proto)
0.0135” (prod.)
Min. Via Pad Diameter:
0.020” (proto)
0.025” (prod.)
SMT Pitch:
0.010”
Min. Blind & Buried Vias
0.010” (prototype)
0.0118” (production)
BGA, mBGA Pitch:
0.8mm (prototype)
1.0mm (production)
Material:
High Tg Epoxy Materials
Cyanate Ester
Teflon
Rogers 4003
Copper-Invar-Copper
Getek
Kevlar
Copper-Moly-Copper
FR4
Polyimide
Nelco 13 & N6000
BT
Thermount (non-woven Kevlar)
Soldermask:
Dry Film Mask (3 or 4 mils)
Enthone Liquid Photo Imageable (LPI) Various Colors
Conformask
Surface Finishes:
HASL
SMOBC
Gold over Cu
Gold over Palladium
Selective Gold
Hard & Soft
Gold
Electroless Nickel
Immersion Gold
Immersion Tin
Electroless Copper
OSP (Organic Solderability Preservative)
Gold over Ni over Cu
Electrical Test:
|
Voltage: |
10-250 volts |
|
Isolation: |
10 Kilohms to 500 Megohms |
|
Continuity: |
1 to 1,000 ohms |
|
Impedance: |
Single ended and differential |
|
Net list testing: |
Single & Dual Access Fixtures
Flying Probe |
